Semiconductor packaging — US PTAB Patent Cases
4 decisions indexed
Page 1 of 1 · 4 total
Taiwan Semiconductor Manufacturing Company Ltd. et al. v.MYW Semitech, LLC
TSMC and Apple have filed an IPR petition challenging U.S. Patent 11,107,768, asserting that all 28 claims are obvious over multiple prior‑art references covering chip‑package technology.
Taiwan Semiconductor Manufacturing Company Ltd. et al. v.MYW Semitech, LLC
TSMC and Apple have filed an IPR petition challenging 27 claims of MYW Semitech’s chip‑package patent. The petition alleges obviousness over several prior‑art references covering interposer and bump technologies.
Apple Inc. v.TopWire, LLC
Apple has filed an IPR petition seeking cancellation of all nine claims of TopWire’s ’202 Patent covering a spacer‑connector package‑on‑package structure, alleging obviousness over Chen, Sun, Wu and Furuta references.
Taiwan Semiconductor Manufacturing Company Ltd. et al. v.MYW Semitech, LLC
TSMC and Apple have filed an IPR petition challenging MYW Semitech’s 11,538,763 chip‑package patent, asserting that all 23 claims are obvious over multiple prior‑art references. The petition seeks to invalidate the patent before the PTAB.
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