Materials science — US PTAB Patent Cases
34 decisions indexed
Page 2 of 2 · 34 total
US Conec Ltd. v.Senko Advanced Components, Inc.
US Conec and Senko Advanced Components settled their dispute, leading the PTAB to terminate multiple IPRs, including the challenge to U.S. Patent 11,307,369. The Board granted the joint motion to terminate and partially approved confidentiality treatment of the settlement agreement.
Solus Advanced Materials Co., Ltd. et al. v.SK nexilis Co., Ltd.
Solus Advanced Materials Co. lost its request for rehearing after the PTAB denied institution of IPR against SK nexilis regarding copper foil patents.
Solus Advanced Materials Co., Ltd. et al. v.SK nexilis Co., Ltd.
Solus Advanced Materials Co., Ltd.'s request for rehearing was denied by the PTAB, upholding the initial decision to deny institution of IPR against SK nexilis's copper foil patent.
JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. v.P2i Ltd.
JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. successfully petitioned to challenge P2i Ltd.'s patent (11041087) before the PTAB, leading to institution of the IPR. The petitioner alleges that the polymer coating claims are obvious over combinations of prior art references like Cohen and Legein.
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