Electronic components — US PTAB Patent Cases
13 decisions indexed
Page 1 of 1 · 13 total
Apple Inc. v.ImberaTek, LLC
Apple and ImberaTek have filed a joint motion to terminate the IPR over U.S. Patent 7,732,909. The parties cite a settlement agreement and PTAB good‑cause precedent to end the pre‑institution proceeding.
Apple Inc. v.ImberaTek, LLC
Apple and ImberaTek have settled their dispute over a PCB insulation patent, filing a joint motion to terminate the pending IPR. The Board is asked to dismiss the case on good‑cause grounds before institution.
Amphenol Corporation v.Credo Technology Group Ltd.
Amphenol and Credo Technology Group settled four related IPRs before trial, leading the Board to terminate the proceedings and treat the settlement agreement as confidential business information.
Amphenol Corporation v.Credo Technology Group Ltd.
Amphenol and Credo Technology settled four related IPRs, leading the Board to terminate the proceedings before trial. The settlement agreement was ordered confidential under 37 C.F.R. § 42.74(c).
Senko Advanced Components, Inc. et al. v.US Conec Ltd.
Senko Advanced Components and US Conec settled their IPR dispute over a RF connector patent, leading the PTAB to terminate the proceeding before institution.
Senko Advanced Components v.US Conec Ltd.
Senko Advanced Components and US Conec settled their dispute over U.S. Patent 11,880,075 B1. The parties filed a joint motion to withdraw the IPR petition, and the Board terminated the proceeding, sealing the settlement agreement as confidential.
Apple Inc. v.ImberaTek, LLC
Apple and ImberaTek have settled their dispute over U.S. Patent 7,732,909 and jointly filed a motion to terminate the pending IPR, citing good cause and the early stage of the proceeding.
Senko Advanced Components, Inc. v.US Conec Ltd.
Senko Advanced Components and US Conec settled their dispute over a magnetic‑connector patent, leading the PTAB to terminate the post‑grant review before institution.
US Conec Ltd. v.Senko Advanced Components, Inc.
US Conec Ltd. and Senko Advanced Components have settled their IPR dispute over U.S. Patent 11,307,369. They jointly request the settlement be kept confidential and move to terminate the IPR.
Microchip Technology, Inc. v.Aptiv Technologies AG et al.
Microchip Technology challenges Aptiv’s USB‑hub patent, arguing the PTAB’s denial of institution was an abuse of discretion for failing to construe “having” and to analyze prior art. The petitioner seeks Director Review to overturn the decision.
Samsung Electronics Co. Ltd et al. v.Maxell, Ltd.
The USPTO denied Samsung's request for Director Review of the Final Written Decision in IPR2024-00735, leaving the prior decision in place.
IKEA Supply AG et al. v.Everlight Electronics Co., Ltd.
IKEA Supply AG and Everlight Electronics settled their inter partes review of U.S. Patent 9,640,733 B2. The Board granted a joint motion to terminate the proceeding and kept the settlement agreement confidential.
Amphenol Corporation v.Credo Technology Group Ltd.
Amphenol and Credo have settled their IPR dispute over U.S. Patent 11,012,252 and jointly request that the settlement agreement be kept confidential under statutory provisions.
Dealing with a patent challenge?
Whether it's a Section 3(d) rejection, a post-grant opposition, or a FRAND dispute, Arctic's patent litigation team has handled it. Get a strategy call.