Electronic components — US PTAB Patent Cases
7 decisions indexed
Page 1 of 1 · 7 total
Amphenol Corporation v.Credo Technology Group Ltd.
Amphenol and Credo Technology Group settled four related IPRs before trial, leading the Board to terminate the proceedings and treat the settlement agreement as confidential business information.
Senko Advanced Components, Inc. et al. v.US Conec Ltd.
Senko Advanced Components and US Conec settled their IPR dispute over a RF connector patent, leading the PTAB to terminate the proceeding before institution.
Senko Advanced Components v.US Conec Ltd.
Senko Advanced Components and US Conec settled their dispute over U.S. Patent 11,880,075 B1. The parties filed a joint motion to withdraw the IPR petition, and the Board terminated the proceeding, sealing the settlement agreement as confidential.
US Conec Ltd. v.Senko Advanced Components, Inc.
US Conec Ltd. and Senko Advanced Components have settled their IPR dispute over U.S. Patent 11,307,369. They jointly request the settlement be kept confidential and move to terminate the IPR.
IKEA Supply AG et al. v.Everlight Electronics Co., Ltd.
IKEA Supply AG and Everlight Electronics settled their inter partes review of U.S. Patent 9,640,733 B2. The Board granted a joint motion to terminate the proceeding and kept the settlement agreement confidential.
Samsung Electronics Co. Ltd et al. v.Maxell, Ltd.
The USPTO denied Samsung's request for Director Review of the Final Written Decision in IPR2024-00735, leaving the prior decision in place.
Microchip Technology, Inc. v.Aptiv Technologies AG et al.
Microchip Technology challenges Aptiv’s USB‑hub patent, arguing the PTAB’s denial of institution was an abuse of discretion for failing to construe “having” and to analyze prior art. The petitioner seeks Director Review to overturn the decision.
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